<em id="r1dx3"><form id="r1dx3"><th id="r1dx3"></th></form></em>

          <noframes id="r1dx3">

              <form id="r1dx3"></form>

              <address id="r1dx3"><nobr id="r1dx3"><progress id="r1dx3"></progress></nobr></address>

              網站首頁|在線留言|聯系我們

              歡迎來到北京華沛智同科技發展有限公司

              北京華沛智同科技發展有限公司

              全國服務熱線:010-82630761
              北京華沛智同科技發展有限公司

              相關文章

              您現在位置:首頁 > 產品中心 >Logitech精密材料表面處理>精密切割設備
              產品圖片 產品名稱/型號 產品描述
              • 瀏覽量:2781

                更新時間:2016-07-05

                查看詳細介紹
                The AWS1 Abrasive Wire Saw allows fragile or diffi cult materials to be cut or wafered without fear of the samples being damaged. Designed for use in photonics, semiconductor, opto-electronics
              • 瀏覽量:1402

                更新時間:2016-04-19

                查看詳細介紹
                The APD1 is a combined annular and precision saw ideal for slicing wafers, crystals or semiconductor components up to 55mm in diameter. It is also suitable for precision dicing of wafers up to 100mm
              • 瀏覽量:1395

                更新時間:2016-04-19

                查看詳細介紹
                The GTS1 Thin Section Cut-off and Trim Saw is ideal for geological application areas - cutting hard or soft rocks, concretes or cements with equally high effi ciency.
              共 3 條記錄,當前 1 / 1 頁  首頁  上一頁  下一頁  末頁  跳轉到第頁 
              點擊這里給我發消息
               
              亚洲Av无码一区二区三区在线播放_精品国产aⅴ无码一区二区蜜桃_久久aⅴ人妻少妇嫩草影院_九九线精品视频在线观看视频

                  <em id="r1dx3"><form id="r1dx3"><th id="r1dx3"></th></form></em>

                      <noframes id="r1dx3">

                          <form id="r1dx3"></form>

                          <address id="r1dx3"><nobr id="r1dx3"><progress id="r1dx3"></progress></nobr></address>